
Neurotechnological Solutions Platform (NTSP) is a high-technology center of excellence focused on neurotechnology.
NTSP, led by BOUN and with the support of NEUROFUND, established collaboration for translation of co-developed neurotechnology innovations into the industry and market among 9 Associated Partners of Neurotech Alliance, namely:
- Industry – Karel Electronics, ASPILSAN, Interact Technologies, Siemens Healthineers;
- Academia – Bilkent University, Sabancı University, Yeditepe University and Istanbul University;
- Technology Transfer Services – BOUN TTO and NEUROFUND.
Research Infrastructures Neurotechnological Solutions Platform utilizes and thereby builds collaboration across Alliance partners are:
Made in NTSP
Brain-Machine Interface Systems Lab (BMISLab)
Digital Twin Infrastructure
HPC Cluster
Since neurotechnology involves research and development in sensors, instrumentation, big data, artificial intelligence, machine learning, algorithms, and context-aware decision-making within the scope of neuromorphic (brain-inspired) technologies, it is an extremely current and future-defining field that covers all engineering, health sciences and basic sciences disciplines, as well as education sciences and green/sustainable industry, economy and finance.
The aim of NTSP is to provide advanced technological solutions to major challenges that widely affect the brain, extremities, individuals, and society, such as neurological diseases, limb amputation, cerebral palsy, stroke, Parkinson’s disease, multiple sclerosis, Alzheimer’s disease, aging, and educational-cognitive issues. The platform seeks to develop outputs that are suitable for industrial processes and have high added value, economic, and societal impact.
Active and Passive exoskeletons have been developed by the NTSP for Cerebral Palsy patients, among others, for improved mobility and for factory workers for reduced fatigue and injury risk have reached Technology Readiness Level of 8. The prototypes of these devices are being tested under NATO DIANA funds and are close to hitting the market.